Innovations in mobile technology are constantly being noted, and Micron Technology, Inc. and HONOUR have recently announced the most recent developments. The result of their partnership is the incorporation of Universal Flash Storage (UFS) 4.0 and Micron’s state-of-the-art LPDDR5X memory into HONOR’s flagship smartphone, the HONOUR Magic6 Pro. Through the use of a large language model (LLM) known as MagicLM, which has seven billion parameters, this integration aims to significantly advance the capabilities of on-device AI.
In order to provide the best AI experiences at the edge, Mark Montierth, corporate vice president and general manager of Micron’s Mobile Business Unit, was cited as highlighting the significance of enhanced memory and storage performance. According to Montierth, the HONOUR Magic6 Pro has unparalleled performance, improved power efficiency, and significant capacity—all necessary for top AI smartphones—thanks to the combination of LPDDR5X and UFS 4.0 solutions.
The HONOUR Magic6 Pro’s intent-based user interface (IUI) in the MagicOS 8.0 operating system is a noteworthy advancement. This interface uses platform-level AI to read and infer user intent from a variety of inputs, including text, images, gestures, and eye movements. This makes it possible for services to be offered proactively in a variety of areas, such as retail, entertainment, productivity, and travel, improving users’ everyday and digital experiences.
Innovative firmware and hardware features have been created as a result of the collaboration between the engineers at Micron and the research and development teams at HONOUR. By improving the HONOUR Magic6 Pro’s performance and user experience, these features also support the larger mobile ecosystem.
In addition to this news, Micron at Mobile World Congress also presented an improved version of its UFS 4.0 technology. This version further solidifies Micron’s leadership in the mobile space and speeds up smartphone users’ AI experiences by introducing proprietary firmware features in the smallest managed NAND package available.
Leading provider of memory and storage solutions, Micron Technology, Inc. is changing how people use information all around the world. Its dedication to technological leadership, customer attention, and production quality makes it possible to produce a wide range of high-performance DRAM, NAND, and NOR memory and storage devices. These developments are essential to the growth of the data economy, 5G applications, and artificial intelligence.
One way that the Micron UFS 4.0 technology sets itself apart is that it provides the smallest possible package size intended for smartphones of the future. It includes brand-new, exclusive firmware features designed to improve smartphone AI. Concurrently, Micron’s top-performing 1-beta (1β) manufacturing node powers the LPDDR5X memory, which reaches a maximum speed grade of 9.6 Gb/s, enabling AI to be used in premium smartphone experiences.
With the ability to give workload-customized power and performance, this memory solution not only offers a nearly 30% increase in power efficiency over its predecessor, but it also offers a peak bandwidth that is over 12% quicker. LPDDR5X is positioned as the premier low-power memory solution for high-bandwidth and low-latency AI applications, and it is available in densities up to 16GB.
Micron’s LPDDR5X memory has been well received by the market thanks to its partnership with Qualcomm and validation on the most recent flagship chipset, the Snapdragon® 8 Gen 2 Mobile Platform. This partnership highlights how important it is to have quick AI inferencing at the edge, which is made possible by the memory’s exceptional performance.
